Supporting Information for “Critical Factors of the 3D Microstructural Formation in Hybrid Conductive Adhesive Materials by X-ray Nano-tomography”

Appendix 1-Experimental Details Preparation of the conductive adhesive tracks was accomplished by first mechanically mixing a typical thermoset type of adhesive test vehicle with a loading between 78-85 wt% of silver-plated copper to form a uniform paste. The composition is then applied onto a substrate to form conductive traces or electronic circuitry. Usual methods of applying the composition to a substrate include dispensing by stencil, screen, rotogravure or flexo printing, with screen printing being generally used for this application. The thermoset adhesive filled with Ag-Cu was then cured for 30 min at 170ºC under nitrogen and let cool down for 1h before testing. The set thermoset adhesive filled with Ag-Cu was then cut into a sharp wedge-shaped sample and mounted onto a stainless steel pin with epoxy to allow x-ray nano-[12]. An x-ray energy of 8 keV was used with the field of view of 40 x 40 µm 2. A CCD Electronic Supplementary Material (ESI) for Nanoscale.